Board and system connectivity

Server interconnection solutions.

Representative power and signal connectivity for PCIe 5.0 and 6.0 server architectures, including CRPS, OCP NIC, Multi-Trak, and MCIO options.

Review product details
Server motherboard with board connectors, power interfaces, and high-speed interconnect points

01

CRPS power

02

OCP NIC

03

SFF-1033

04

SFF-1016 MCIO

Product overview

Interconnect choices mapped to the server architecture.

Bohdi supports system-level server interconnection across power, signal, and high-speed data paths. The representative configurations below provide a practical baseline for platform-level discussions.

01

CRPS power connector options

02

OCP NIC connectivity for PCIe 5.0 and 6.0

03

SFF-1033 Multi-Trak configurations

04

SFF-1016 MCIO in 4X, 8X, 16X, and 24X

Technical evidence

Representative server interconnection matrix.

Representative configurations from Bohdi’s current portfolio. Final electrical, mechanical, and compliance requirements are confirmed for each program.

CRPS power

Power 50-pin

VT / R/A power

12P+4P, 2×2 power, 1×4 power

OCP NIC

PCIe 5.0/6.0 with SMBus and 2×4 fan

SFF-1033 Multi-Trak

74P+4P, 148P+4P, 148P+8P

SFF-1016 MCIO

PCIe 5.0/6.0

MCIO lane options

4X, 8X, 16X, 24X

Target applications

  • Rack servers
  • GPU trays
  • Server NICs
  • Riser and internal cable assemblies
  • Chip-to-chip, chip-to-I/O, and flyover architectures

Bring your next interconnect challenge to Bohdi.

From standard solutions to full custom design and integration, start with the system requirements that matter most.

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info@bohdi-corp.com

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