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Enterprise-grade
Performance engineered for demanding AI and HPC infrastructure.
AI data center infrastructure
Interconnects AI Data Centers. Every layer of the system.
High-speed connectivity, power distribution, and custom integration for next-generation AI data centers and HPC—from chip-level links to 1.6T external connectivity.
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Chip-level
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Board & system
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Rack & power
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1.6T external
Why Bohdi
Built for the point where components become systems.
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Precision-built
Manufacturing anchored in Thailand with key EMS alliances.
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Built to integrate
Mechanical design, SI simulation, PCB, SMT, assembly, and validation.
Portfolio coverage
The complete interconnection stack, without the handoffs.
One portfolio spanning internal high-speed links, external connectivity, power, signal, and full custom integration.
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High-speed internal
PCIe Gen4 / Gen5 / Gen6
MCIO · Multi-Trak · SlimSAS · MiniSAS HD · Gen-Z · OCP
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External connectivity
Up to 1.6T
DAC · ACC · AEC · QSFP-DD · OSFP · SFP
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Board-level connectors
High-density I/O
SMT cages · OCP NIC · Floating BTB · Custom mechanics
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Power distribution
150A–750A systems
CRPS · Busbar assemblies · Up to 300A per pin
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Signal connectivity
1.0mm–7.92mm pitch
Fan · Battery · Control · RJ45 · USB-C · HDMI · DisplayPort
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Vertical integration
Design through validation
Mechanical · SI simulation to 40GHz · PCB · SMT · Testing
Representative product pages
Go deeper on selected portfolio examples.
Review representative specifications and application context, then bring Bohdi your system requirements.
External connectivity
QSFP-DD 800G cable assemblies
800G PAM4 performance, configurable cable construction, length, EEPROM, and pull-tab options.
Representative product family
Universal Quick Disconnects
Straight, bulkhead, compact, right-angle, rotary-joint, and one-inch configurations.
Board and system connectivity
Server interconnection solutions
CRPS, OCP NIC, Multi-Trak, and MCIO options for PCIe 5.0 and 6.0 systems.
Interconnect architectures for switch, rack, GPU tray, server NIC, and direct-attach layers.
System integration
Designed around the system—not just the connector.
- TOR / switch boxes and trays
- Rack servers and GPU trays
- Server NICs
- Flyover architectures
- DAC and AEC assemblies
External connectivity
800G-ready. 1.6T roadmap.
A focused external connectivity portfolio built for evolving PAM4 data rates and next-generation system bandwidth.
- QSFP-DD800 MSA compliant
- IEEE 802.3ck 800G-PAM4 Ethernet
- 112Gbps per lane
- Up to 800Gbps total bandwidth
